Microsoft’s Xbox team has unveiled the details of its new system-on-a-chip (SoC), that powers its newer, slimmer Xbox 360 250GB model.
The benefits of this SOC would be as follow:
- A desktop-class processor to combine CPU, GPU, memory, and I/O logic onto a single piece of silicon
- Promise to lower the cost of making the console by reducing the number of different chips needed for the system
- Shrinking the motherboard
- Reducing the number of expensive fans and heatsinks
- Produced on the IBM/GlobalFoundries 45nm process
Besides, the SoC also makes the new Xbox design more power efficient, which is nice for consumers, but the real motivation behind boosting the console’s efficiency is to reduce the size and cost of the power supply unit.
Compared to the distinct, 90nm CPU/GPU combo in the original 360 from 2005, the new 45nm SoC draws over 60% less power and reduces the total silicon area by over 50%. The power and die area savings mean that Microsoft can do with a single fan and heatsink what previously required multiple heatsinks and fans.
Tags: combo, heatsink, microsoft, new xbox, power supply unit, soc, system on a chip, xbox 250 gb, Xbox 360, xbox 360 250 gb model, xbox 360 gpu, xbox 360 slim